doc. no : qw0905-la110b/xxyg-pf rev. : a date : 31 - mar. - 2017 data sheet led array la110b/xxyg-pf pb lead-free parts ligitek electronics co.,ltd. property of ligitek only l dcc
note : 1.all dimension are in millimeter tolerance is part no. la110b/xxyg-pf ligitek electronics co.,ltd. property of ligitek only page 1/8 2.54typ ? ?????
la110b/xxyg-pf part no. la110b/xxyg-pf 138 8.020 1.72.6 56530 green gap yellow diffused g 120 100 10 30 ligitek electronics co.,ltd. property of ligitek only unit ma mw ? o
12 13 10 11 9 45 30 4565 12 20 8 20 30 12 group luminous intensity(mcd) at 10 ma group g chip 12 13 11 9 10 luminous intensity(mcd) at 10 ma min. max. 30 45 20 45 65 30 8 12 min. 12 20 max. brightness code for standard led lamps part no. la110b/xxyg-pf y chip page 3/8 ligitek electronics co.,ltd. property of ligitek only bin code
brightness code for standard led lamps part no. la110b/xxyg-pf g chip 7 9 8 group y chip 16 17 15 group color code 565 564 566 565 567 566 wave length(nm) at 10 ma min. max. 587 589 585 589 592 587 wave length(nm) at 10 ma min. max. ligitek electronics co.,ltd. property of ligitek only page4/8
3.0 2.5 1.5 1.0 0.5 0.0 2.0 fig.4 relative intensity vs. temperature 1.0 r e l a t i v e i n t e n s i t y @ 2 0 m a 550 wavelength (nm) 500 0.0 0.5 600650700 ambient temperature(
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature(
dip soldering preheat: 120
the purpose of this test is the resistance of the device under tropical for hours. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. this test intended to see soldering well performed or not. 1.t.sol=245
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